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| (R) STPS2H100A/U HIGH VOLTAGE POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 2A 100 V 175 C 0.65 V FEATURES AND BENEFITS NEGLIGIBLE SWITCHING LOSSES HIGH JUNCTION TEMPERATURE CAPABILITY LOW LEAKAGE CURRENT GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP AVALANCHE RATED DESCRIPTION Schottky rectifier designed for high frequency miniature Switched Mode Power Supplies such as adaptators and on board DC/DC converters. Packaged in SMA or SMB. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM Tstg Tj dV/dt Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage TL = 130C = 0.5 tp = 10 ms sinusoidal tp=2 s F=1kHz square tp = 100 s square Value 100 10 2 75 1 1 - 65 to + 175 175 10000 Unit V A A A A A C C V/s SMA (JEDEC DO-214AC) STPS2H100A SMB (JEDEC DO-214AA) STPS2H100U November 1998 - Ed: 3A 1/6 STPS2H100A/U THERMAL RESISTANCES Symbol Rth (j-l) Junction to lead Parameter SMA SMB STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameter Reverse leakage current Tests conditions Tj = 25C Tj = 125C VF ** Forward voltage drop Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 5 ms, < 2% ** tp = 380 s, < 2% Value 30 25 Unit C/W Min. Typ. Max. 1 Unit A mA V VR = VRRM 0.4 IF = 2 A IF = 2 A IF = 4 A IF = 4 A 0.69 0.6 1 0.79 0.65 0.88 0.74 To evaluate the maximum conduction losses use the following equation : P = 0.56 IF(AV) + 0.045 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature (=0.5). IF(av)(A) 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Rth(j-a)=Rth(j-l) PF(av)(W) 1.8 = 0.2 = 0.1 = 0.5 1.6 = 0.05 1.4 1.2 =1 1.0 0.8 0.6 T 0.4 0.2 tp IF(av) (A) =tp/T 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 SMA Rth(j-a)=100C/W S(Cu)=1.5cm SMB Rth(j-a)=80C/W S(Cu)=1.5cm T =tp/T tp Tamb(C) 50 75 100 125 150 175 0 25 2/6 STPS2H100A/U Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values) (SMB). IM(A) 10 9 8 7 6 5 4 3 IM 2 1 0 1E-3 Fig. 4: Non repetitive surge peak forward current versus overload duration (maximum values) (SMA). IM(A) 8 7 6 5 4 3 Ta=50C Ta=50C Ta=100C Ta=100C Ta=150C t 2 1 0 1E-3 IM t Ta=150C =0.5 =0.5 t(s) 1E-2 1E-1 1E+0 t(s) 1E-2 1E-1 1E+0 Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Fig. 6: Relative variation of thermal impedance junction to ambient versus pulse duration (SMA). Zth(j-a)/Rth(j-a) 1.0 Printed circuit board: S(Cu)=1.5cm (e=35m) 0.9 0.8 0.7 0.6 = 0.5 0.5 0.4 0.3 = 0.2 0.2 = 0.1 0.1 tp(s) Single pulse 0.0 1E-2 1E-1 1E+0 1E+1 T =tp/T tp 1E+2 1E+3 Zth(j-a)/Rth(j-a) 1.0 Printed circuit board: S(Cu)=1.5cm (e=35m) 0.9 0.8 0.7 0.6 = 0.5 0.5 0.4 0.3 = 0.2 0.2 = 0.1 0.1 tp(s) Single pulse 0.0 1E-2 1E-1 1E+0 T =tp/T tp 1E+1 1E+2 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(A) 1E+0 Tj=125C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) 200 100 F=1MHz Tj=25C 1E-1 Tj=100C 1E-2 1E-3 1E-4 Tj=75C 50 VR(V) Tj=25C 20 10 VR(V) 1 2 5 10 20 50 100 1E-5 0 10 20 30 40 50 60 70 80 90 100 3/6 STPS2H100A/U Fig. 9: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35m) (SMB). Rth(j-a) (C/W) 120 100 80 60 40 20 S(Cu) (cm) 0 0 1 2 3 4 5 Fig. 10: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35m) (SMA). Rth(j-a) (C/W) 140 120 100 80 60 40 20 S(Cu) (cm) 0 0 1 2 3 4 5 Fig. 11: Forward voltage drop versus forward current . IFM(A) 1E+1 Tj=125C Maximum values 1E+0 Tj=125C Typical values Tj=25C Maximum values 1E-1 VFM(V) 1E-2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 4/6 STPS2H100A/U PACKAGE MECHANICAL DATA SMA DIMENSIONS E1 REF. D Millimeters Min. Max. 2.70 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.106 0.008 0.065 0.016 0.220 0.181 0.116 0.063 A1 A2 b 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 E c A1 E E1 b C L A2 D L FOOT PRINT (in millimeters) 1.65 1.45 2.40 1.45 5/6 STPS2H100A/U PACKAGE MECHANICAL DATA SMB E1 DIMENSIONS REF. D Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 A1 A2 b E c E A1 E1 D b C L A2 L FOOT PRINT (in millimeters) 2.3 1.52 Ordering type STPS2H100A STPS2H100U 2.75 Marking S21 G21 1.52 Package SMA SMB Weight 0.068g 0.107g Base qty 5000 2500 Delivery mode Tape & reel Tape & reel Band indicates cathode Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 6/6 |
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